Ultra-flat thermal SiO2 wafers, 200nm, type <100> stock Desiccant weight is 46g

Desiccant weight is 46g

some particles can be missing or could have been on a different location

up to overnight also work well

red and green Wire gauge (AWG) / Number of strands 24 / 7 Wire insulation PTFE Wire length 8" Operating temperature -20°C to 125°C Applications High voltage or instrumentation CF feedthroughs available upon enquiry

Ultra-flat thermal SiO2 wafers, 200nm, type <100> stock Desiccant weight is 46gThe Ultra Flat SiO2 substrates consist of a 200nm thermally grown amorphous SiO2 film on an ultra flat silicon wafer. SiO2 is one of the most characterised materials and is widely used in semiconductor manufacturing, thin film research and as substrate for growing cells. It can be directly used as substrate for AFM and SEM imaging. The ultra flat thermal silicon dioxide substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and